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April 2004

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From:
"Bloomquist, Ken" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Apr 2004 10:20:22 -0700
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This is one of those questions to resolve a discussion we are having regarding the size of glue dots.

We have had several failures in the past due to flux contamination under some 0805 resistors causing a high impedance short. We found some issues with the cleaning process that when corrected, I believe, fixed the problem. We also changed the aperture of the stencils to a smaller oval pattern.

My question is, does a glue dot that bridges under a part from pad to pad (no chip bonder on the actual pads) make it any harder to clean than a glue dot that does not bridge from pad to pad?

My feeling is that the cleaning process should clean off the flux in either condition.

Thanks in advance for your expert opinions.

KennyB

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