Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 27 Apr 2004 06:30:19 -0700 |
Content-Type: | text/plain |
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Bev,
Without our help, does this leave the completion of your task " hanging in
the balance".
Dewey
> -----Original Message-----
> From: Bev Christian [SMTP:[log in to unmask]]
> Sent: Monday, April 26, 2004 2:27 PM
> To: [log in to unmask]
> Subject: [TN] Trying to Build Master Solderability Paper List
>
> Greetings!
> I signed off after APEX and got so busy that I am just getting around to
> signing back on.
>
> Anyway, I'm in one of my list building moods again. The last one was for
> lead free websites. This time I would like to build a master list of
> papers where a wetting balance was used for testing components and/or
> finishes and/or solders. I have tried doing this through Yahoo and Google
> and it is terrible. I have some of the NEPCON, SMI, SMTAI, APEX and IPC
> Lead Free proceedings, access to the SMTA website and access to only two
> ECTC proceedings. This is actually only a small faction of the papers out
> there. SO I NEED SOME HELP. E-mail me directly, NOT TechNet, and I will
> compile it all and share it with the whole Technet crew. Thanks.
> Bev Christian
> Research in Motion
>
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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