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April 2004

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Subject:
From:
Lum Wee Mei <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Apr 2004 08:25:42 +0800
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Roger,

I would like to share what I have just discussed and learned from Robert
while reading his book on "High Power Printed Circuit Design Notebook".
He replied me on a similar question that I asked of him.

He replied as "Typically, start with say 54ox of copper as a base and
plate 6 to get 10oz on the surface an d6 in the hole. For some power
boards that require more in the via/hole, he would start with 1oz and
plate 9oz so the surface has 10 and the hole has 9oz."

For you case, I guess it is not possible to have same copper thickness
for both surface and thickness. Then, I may be wrong as your vendor
should be able to advice. Hope my information can be of some help.

Regards,
Wee Mei

Roger Alexander wrote:

>Hello all,
>   I have a question concerning the stack-up for a 2 layer board in which
>I need 3 oz. copper plating in the barrels.  What copper foil thickness
>should I specify?  I want to insure that I get 3 oz. copper for all
>lands/traces and in the barrels of all holes.  I have never specified 3
>oz. copper and didn't really know what is typically done for 3 oz. copper.
>
>Thank you,
>
>Roger
>
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