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April 2004

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Subject:
From:
"Victor G. Hernandez" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 22 Apr 2004 15:05:49 -0500
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Guy,

    Who is the SMART GROUP that you mention on this note.   Is there a
web site/URL address you can share.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Thursday, April 22, 2004 3:02 PM
To: [log in to unmask]
Subject: Re: [TN] IPC standard on paste height?


The Smart Group has produced a nice little set of images that seem
suitable for solder paste print acceptance criteria. As you suggest,
direct measurement of solder paste height is not one of the acceptance
criteria. Though, it may make sense to include height, if it can be
measured easily enough to be cost effective. Variation is the attribute
of interest. If you are getting 1 to 1.5 mil variation and start seeing
3 or 4 mil something is up.


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
> Sent: Wednesday, April 21, 2004 10:46 AM
> To: [log in to unmask]
> Subject: [TN] IPC standard on paste height?
>
> Hi Technos,
>
> the fact that paste height is maybe not a relevant and worthwile 
> factor to measure has been brought up several times on this forum. My 
> experience also says that I will have the same acceptable joints 
> whether using a 6 mil stencil or a 5 mil one, if the paste deposits 
> are uniform (nice bricks). But if I write a procedure setting the 
> control zone between 5.5 to 8 mils I will get flamed by both the 
> customers auditing the process and my bosses.
>
> Is there any standard/handbook/specification that sets control limits 
> for the height of the paste after stencil printing? Or which 
> prescribes other measurable indicators for good printing?
>
> I must mention that I only have an LSM that can measure the height, no

> volume checking available.
>
> Thanks,
> Ioan

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