Phil,

By any chance have you measured DK (i.e., dielectric constant)change after a temperature soak.

Regards,
George

George M. Wenger (908)-546-4531 
Reliability Engineer
RF Power Amplifier Group
Andrew Corporation,  40 Technology Drive, Warren, NJ 07059
[log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phillip E. Hinton
Sent: Thursday, April 22, 2004 12:11 PM
To: [log in to unmask]
Subject: Re: [TN] PCBA at higher temperatures


Larry

I have done this temperature soak a number of times with FR4 and do not find
any degradation of the assembly properties of the laminate except there is a
significant browning of the laminate.  It looks like polyimide after baking.
There is s slight degrease in the surface resistance when subjected to
humidity. However, I have not tested flashover strength or arc resistance after baking.

Phil Hinton    .

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