HI Phil,

Have not seen any replies from you lately.  Yes, the higher temperature
solders will withstand the soak temperature better but I think the issue is will
the FR4 withstand the assembly temperatures.

Larry Tawyea


In a message dated 4/19/04 10:31:15 AM Central Daylight Time,
[log in to unmask] writes:


>
> The board and solder joints will survive; however, metallurgical changes in
> the solder such as increased intermetallic thickness and coarse grain growth
> may occur in the solder which will degrade the boards for future life if many
> thermal cycles are seen during operation.  Many of the lead-free higher temp
> solders will easily withstand this testing much better.
>
> Phil Hinton
>
>



---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------