ATTENTION!!
Designers and Manufacturers

BGA Design and Assembly Process Implementation Workshop

May 27-28, 2004 ? Philadelphia, PA

Instructors: Dieter Bergman, IPC - Association Connecting Electronics Industries & Ray Prasad, Ray Prasad Consultancy Group

This workshop addresses industry concerns from those people contemplating using BGAs to those who process high quality assemblies.

What You Will Learn:
* Challenges to implementing BGA and Fine Pitch BGA technology
* Land pattern routing descriptions
* Surface finish strategy and requirements
* New x-ray technology for defect assessment
* Void accept/reject criteria
* Examples of BGA joint conditions
* Critical inspection, repair, and reliability issues associated with BGAs
* Acceptance and how to determine the reliability of assembly and attachment processes

Price: $495 IPC/Designers Councils Member               $695 Non-member


REGISTER NOW! For more information or to download the registration form, please go to http://www.ipc.org/calendar/BGADesign_52704/BGADesign_52704.htm.

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