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April 2004

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Subject:
From:
"Morse, Carrie" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Apr 2004 17:16:34 -0400
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text/plain (54 lines)
MSD's need baking only if they have exceeded their exposure limits.
We use a McDry for Reeled parts.
Periodically, we need to remove the parts from T+R, bake, then put them
in tubes or trays.

The best thing to do is control the exposure time if possible.

-Carrie 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Marsico, James
Sent: Tuesday, April 20, 2004 4:20 PM
To: [log in to unmask]
Subject: [TN] Moisture sensitive Components

Good Day Technet:
Being a military OEM, we've never had to use plastic components but
we're just starting to use them.  I'm embarrassed by the amateurish
nature of this question, but I have no one else to turn to, so here
goes...  I know that moisture-sensitive components require baking prior
to reflow, but how do you bake components that are supplied in tape and
reel?  Can the tape and reels be baked along with the components or do
you have to remove the parts and re-package after baking?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

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