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April 2004

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Apr 2004 16:55:27 -0400
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It depends on the reels and the bake temperature. Do you have a copy of
J-STD-033?

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Marsico, James
> Sent: Tuesday, April 20, 2004 4:20 PM
> To: [log in to unmask]
> Subject: [TN] Moisture sensitive Components
>
> Good Day Technet:
> Being a military OEM, we've never had to use plastic
> components but we're just starting to use them.  I'm
> embarrassed by the amateurish nature of this question, but I
> have no one else to turn to, so here goes...  I know that
> moisture-sensitive components require baking prior to reflow,
> but how do you bake components that are supplied in tape and
> reel?  Can the tape and reels be baked along with the
> components or do you have to remove the parts and re-package
> after baking?
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879

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