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April 2004

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Subject:
From:
"Zweigart, Siegmund" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 19 Apr 2004 16:43:41 +0200
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Hello All

One customer of us wants to keep an assembled FR4 Product (soldered with
SnPb) for 4 days at 150°C to verify one component.
What do you expect in regard to the components / PCB,....?
How thick will the inter metallic phase be after that time.
Will the mechanics of the solder joint still be reasonable?

Siggi

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