Hi Guys,

Major problem!
We have a quad flat pack that is 51 mm body size and am trying to consider
the best approach for assembly (Stevie boy. betcha you jump in on this
one!).
The problem is that it is to be used on two boards & turns out an estimated
8 Watts best board to 18 Watts worst board.
On one board this sucker need to dump the heat into the board & on the other
dump it from the top ie. heat sink fitted to the top.
To make life even easier the rascal needs bolting to the board.......great
for automation.......not!
Anyway, the termination considerations are Cin-apse (Manufacturers test data
doesn't cover our range for stringent Stress screening)
Gull wing (Got real bad experience of trying to assemble these components
with a thermal pad underneath)
CGA (area array) - not sure if this size of component would withstand the
Stress screening

Well chaps you can see the dilemma I'm in....what do you think?

P.s. you've probably guessed it's Military!

Here's hoping,
        Iain.

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