ATTENTION!!
Designers and Manufacturers


BGA Design and Assembly Process Implementation Workshop


April 26-27, 2004 ? Novtel Mississauga ? Mississauga CAN
Instructor: Dieter Bergman, IPC - Association Connecting Electronics Industries

This workshop addresses industry concerns from those people contemplating using BGAs to those who already in production and achieving high quality assemblies.

What You Will Learn:
* Challenges to implementing BGA and Fine Pitch BGA technology
* Land pattern routing descriptions
* Surface finish strategy and requirements
* New x-ray technology for defect assessment
* Void accept/reject criteria
* Examples of BGA joint conditions
* Critical inspection, repair, and reliability issues associated with BGAs
* Acceptance and how to determine the reliability of assembly and attachment processes

Price: $495 IPC/Designers Councils Member               $695 Non-member


REGISTER NOW! For more information or to download the registration form please got to http://www.ipc.org/calendar/BGADesign_4262704/BGADesign_4262404.htm.

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