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April 2004

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Subject:
From:
"Victor G. Hernandez" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Apr 2004 06:15:35 -0500
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Alexandra,

   I am interesting in LF/Reduced Lead workshop in the Central Texas
area.   Can you please advise!

Victor G. Hernandez
Component/Material Failure Analysis Eng.
Blgd:   PS4-1, Rm. 132
Ofc:    512-725-3471
Pgr:    512-907-0005
Fax:   512-725-0662


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Alexandra Curtis
Sent: Wednesday, February 11, 2004 1:23 PM
To: [log in to unmask]
Subject: [TN] Lead Free Workshop Series


Register TODAY for the Lead Free Series!

March 8, 2004 ? Holiday Inn Select Stamford? Stamford, CT
March 10, 2004 ? Courtyard by Marriott ? Columbus, OH


Lead Free System-Part I: Lead Free Interconnections--Technology and
Manufacturing  
Course instructor: Dr. Jennie Hwang
Time: 8:30 am - 11:30 am
      
The purpose of the course is to provide broad-based information, as well
as specific critical factors to facilitate the implementation of
lead-free manufacturing. Environment-friendly manufacturing and
designing products that are ultimately safer at the end of life cycle
are essential to technology-business competitiveness. This workshop will
cover global legislative status, technological base, product assessment
and manufacturing considerations. 

Price: $395 IPC Members $595 Non-members

To download the registration form and more information go to
http://www.ipc.org/calendar/leadfree1_030804/lf1_0308.htm or contact
Alexandra Curtis at [log in to unmask] or via phone at 847-790-5377.
     
Lead Free System-Part II: Lead Free Components & PCB Surface Finish 
Course instructor: Dr. Jennie Hwang
Time: 1:00 pm - 4:00 pm

This course will provide a proper level of understanding of the
important factors that determine the solderability and performance of
surface finishes and component coatings under SMT manufacturing. The
viable material and process options of PCB surface finish and component
lead-coating will be separately reviewed. The instructor will discuss
the role of intermetallics and gold, tin whisker, black pad issue and Bi
effects. 

Price: $395 IPC Members $595 Non-members

To download the registration form and more information go to
http://www.ipc.org/calendar/leadfree2_030804/lf2_0308.htm or contact
Alexandra Curtis at [log in to unmask] or via phone at 847-790-5377.

March 11, 2004 ? Courtyard by Marriott ? Columbus, OH

Lead Free Systems-Part III: Implementation & Production
Course instructor: Jennie Hwang
Time: 8:30 am - 11:30 am

This course focuses on the SMT manufacturing know-how necessary to
achieve the yield, quality and reliability during lead free
implementation. The course covers the key process modules including
solder paste printing and reflow, and discusses the system compatibility
between the BGA/CSP solder sphere, assembly solder paste, component
coating and PCB substrate surface finish.

Price: $395 IPC Members $595 Non-members

To download the registration form and more information go to
http://www.ipc.org/calendar/LeadFree3_031104/lf3_031104.htm or contact
Alexandra Curtis at [log in to unmask] or via phone at 847-790-5377.

Register 3 people from your company and receive the 4th registration
FREE!

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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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