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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 6 Apr 2004 20:25:50 -0700 |
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What kind of finish was on the PCB (ENIG, Tin, Silver, OSP)?
What was the thermal profile during manufacturing?
How moisture sensitive was the part?
What were the storage condtions for the part and the PCB?
Is there part and/or board warpage?
This is a fair start at solving this issue.
David A. Douthit
Manager
LoCan LLC
Liew, Sen Joon wrote:
>Dear Technetters,
>
>We encountered BGA chip having intermitten contact issue in our prototypes. When we pressed hard on the BGA chip, the prototype worked ok. We need advice
>on how to tackle this issue from prototype building's point of view. What measures should be taken to make sure "no contact issue" during prototype building.
>
>Your advice is very much appreciated. Thanks in advance.
>
>Best regards,
>SJ Liew
>
>
>
>
>
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