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April 2004

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Tue, 6 Apr 2004 10:16:07 EDT
Content-Type:
text/plain
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text/plain (26 lines)
In a message dated 4/6/04 8:32:22, [log in to unmask] writes:
<Hi Werner,
> < you bring up an interesting point of view: the EU quality vs. the north
> american quality. Judging by the <general workmanship coming from Germany and
> UK, you can't really beat them. How are they in <electronics assembly?
>  <There is something telling me they will be ready and reliable long before
> us. I would find interesting to <know how MBDA measures up against LMCO and
> NGC!
> <Best regards,
> <Ioan
>  Hi Ioan,
Solder joint reliability is not an issue of workmanship, but of design and
material behavior--and we simply do not know enough about the creep-fatigue
behavior of LF-solders in actual operationng environments.

Regards,
Werner Engelmaier

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