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April 2004

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Wed, 7 Apr 2004 07:08:16 EDT
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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Susan Mansilla <[log in to unmask]>
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Recently we did a failure analysis for a company who thought they had a
similar problem only to find it was not the BGA solder joints, but wedge voids in
vias.  The vias will also be open and shut with flexing of the board.  Just one
more thing to check.

Susan Mansilla
Robisan Lab

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