TECHNET Archives

April 2004

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
[log in to unmask]
Date:
Wed, 7 Apr 2004 07:08:16 EDT
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:
Re: BGA soldering issue
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain; charset="US-ASCII"
From:
Susan Mansilla <[log in to unmask]>
Parts/Attachments:
text/plain (18 lines) 
Recently we did a failure analysis for a company who thought they had a
similar problem only to find it was not the BGA solder joints, but wedge voids in
vias.  The vias will also be open and shut with flexing of the board.  Just one
more thing to check.

Susan Mansilla
Robisan Lab

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2