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High Density Interconnect Technologies
The Greater Boston Chapter of the IPC Designer's Council will
hold its next meeting on Tuesday, April 27th at 6pm in the
cafeteria of American Power Conversion (APC) in Billerica MA.
Tom Buck, Director of Technical Marketing for Dynamic Details,
will bring us up to date on via technologies for today's high
density applications. Blind and buried vias of old aren't the
way to success with active-both-sides boards, but newer ways
to get through a board hold much more promise. Learn what's
different from the old (and oft reviled) sequential lamination
approach to non-through-drilling and how to apply these newer
methods to reduce layer count and overall complexity.
Tom brings many years of experience from many roles in printed
boards. DDi is a premier supplier of high tech boards, both
for quick turn prototypes and ongoing products.
Agenda:
6:00 pm, Arrivals and Pizza, $5/Member, $10/Non-member
6:45 Jeff Seeger - Chapter Update
7:00 Tom Buck, Enabling Technologies (HDI and vias)
Location:
APC, 85 Rangeway Rd, Billerica Mass.
This is off of Route 3 south of Lowell, i.e. between 95 & 495
Take exit 29 (route 129) and proceed East, that is:
If you are traveling South turn right off the ramp,
If you are traveling North turn left off the ramp,
then proceed past Exxon station, then take the 2nd right,
this is Rangeway Rd into Forest Ridge Office Park, proceed to
#85, Building 2.
RSVP's needed:
Please RSVP to either Jeff Seeger [log in to unmask]
or [log in to unmask] by Tuesday noontime, 27-April. We
need this to plan the food order.
President's Note:
I know I have faced many an uphill battle with products
that really need blind and buried via technologies. New
packages, such as .5mm pitch BGAs, demand these methods.
Learn how to deploy the correct new technology, and how
to keep costs and yields well balanced. You may find the
effort and layers spent avoiding them is costing money!
Recently the steering committee decided to change policy and
add member email addresses without permission. If you would
like to skip these postings please send me an email.
The next meeting is scheduled for May 11th, and will be on
Surface Finishes. With lead-free initiatives as well as
ever shrinking components it will pay to know what's up.
Mission:
The physical design of circuit boards is only getting more
complex. Only the physical designer can hope to sort out
the myriad interests that add up to a printed circuit board.
This represents an opportunity to avoid competing with off-
shore labor rates doing routine place and route. Add value!
The Greater Boston Chapter of the IPC Designer's Council is
trying to bring those stake holders, from every discipline,
to show you their problems and solutions so you can add to
your arsenal of knowledge.
Your help and participation would be most appreciated, how
about getting involved!
Thanks and regards,
Jeff Seeger, CTO, Applied CAD Knowledge Inc.
President, Greater Boston Chapter, IPC Designer's Council
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