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March 2004

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Subject:
Re: Dielectric thickness of Class 3 boards
From:
Frank Kimmey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 4 Mar 2004 14:47:01 -0800
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text/plain (55 lines) 
Per IPC-6012B

3.6.2.15 Dielectric Thickness
The minimum dielectric thickness spacing shall be specified in the procurement documentation.
Note: Minimum dielectric spacing may be specified to be 30um [0.0018 in]; however, low profile copper foils should be used and the voltages employed should be taken into consideration so as not to cause breakdown between layers. If the minimum dielectric spacing and the number of reinforcing layers are not specified, the minimum dielectric spacing is 90um [0.00354 in] and the number of reinforcing layers may be selected by the supplier. When the nominal dielectric thickness on the drawing is less than 90um [0.00354 in], the minimum dielectric spacing is 25um [0.00098 in] and the number of reinforcing layers may be selected by the supplier.


The 25um number is from my markup copy from last weeks meetings.
No mention is given to Class as far as I know.
So I think 3.5 mils is probably a good number to use.

Hope it helps,
FNK

Frank N Kimmey CID+
Principle PCB Designer
Powerwave Technologies
EDH 916-941-3159
FAX 916-941-3195
CEL 916-804-2491


-----Original Message-----
From: Franklin D Asbell [mailto:[log in to unmask]]
Sent: Thursday, March 04, 2004 2:12 PM
To: [log in to unmask]
Subject: [TN] Dielectric thickness of Class 3 boards


Can anyone quote me the requirement for dielectric thickness for Class 3
boards, as stated in IPC 6012A.

I've loaned my copy to a company down the street...thanks for a swift
response...anyone...please...

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