TECHNET Archives

March 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Mar 2004 13:35:50 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (74 lines)
Hi Paul,

Until recently we didn't worry much about the whole lead-free issue
since we believe our products fall under the exemptions. But I am
concerned about how the component market is forcing everyone to go into
the leadfree-direction, as it is said that leadfree BGA's are not well
compatible with lead-containing solderpaste. So far I haven't seen any
detailed information about this compatibility issue, but assuming it is
more than just rumours it could become a major problem since most BGA
manufacturers have planned to change to leadfree within a year or so.
Also if you're getting parts with a SnBi coating you're in trouble when
still having and "old" assembly process, as it leads to unreliable
solder joints within a PbSn process.

B.T.W.  If someone has reports or articles with more detailed
information about these backward compatibility issues I would be very
happy to upload these to my website, for all to enjoy.

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net


>>> [log in to unmask] 03/01/04 11:06pm >>>
Hi TechNetters,

My company is starting to determine all the steps that will be
necessary to
convert to Lead-free status and I was just wondering how many of you
have
already done so or are in the process. How far along is everyone and
when do
you expect to be Lead-free? What have been the biggest obstacles? I'm
particularly concerned about sole-sourced components (i.e. connectors)
that
can't withstand the higher oven temps and don't lend themselves to
hand
placement.

Thank you,
Paul Black
Manufacturing Engineer
Kronos
E-mail: [log in to unmask]
Voice: (978) 947-1520

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2