Which forum would that be and what is the address?
>>> [log in to unmask] 3/4/2004 11:21:23 AM >>>
Scott, Before we heat this issue up again on this venue, you might want
to
move that discussion to the Pb-Free forum. Not that I (and others)
wouldn't
like to see it right here, but there is a separate forum for
specifically
that type of question. Last time we jumped into major Pb-free
discussions
here, we were directed by the moderator to take it to the Pb-free
discourse.
Just trying to "head this off at the pass..."
Dale Ritzen, CQA
Quality Manager
Austin Manufacturing Services
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Scott Lefebvre
Sent: Thursday, March 04, 2004 11:12 AM
To: [log in to unmask]
Subject: Re: [TN] Lead-free components in SnPb processes
I would like to add a concern that I have on this issue of Pb Free
components.
What is the industry doing about cross contamination of Pb Free
components
be soldered with SnPb solder as well as SnPb components soldered with
Pb
Free solder. I know of a few concerns about cross contamination but I
would
like to hear what all the techneters have to say on this issue.
Scott
-----Original Message-----
From: Dave Hillman [mailto:[log in to unmask]]
Sent: Wednesday, March 03, 2004 4:56 PM
Subject: Re: Lead-free components in SnPb processes
Hi Blair! One issue to consider with the industry move toward Pbfree
soldering processing is that a number of component fabricators are
moving
to matte tin as a component lead finish. Matte tin is not as robust in
terms of solder process and shelf life solderability in comparison to
a
tin/lead component lead finish (matte tin oxidizes must faster). The
use of
a nitrogen reflow environment and possible changes in your flux
formulation
are two possible avenues of investigation to increase your reflow
process
window . Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
"Blair K. Hogg"
<blair.k.hogg@GAI-T To:
[log in to unmask]
RONICS.COM> cc:
Sent by: TechNet Subject: [TN]
Lead-free
components in SnPb processes
<[log in to unmask]>
03/03/2004 09:28 AM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to "Blair
K. Hogg"
Hi Technetters,
We've been seeing increasing problems in our SMT processes with wetting
of
component leads and I am wondering if our processes which were
designed
around all SnPb materials now need to be updated as I have a strong
suspicion that we are seeing components with lead-free terminations.
Are lead-free components drop-in replacements in SnPb processes? Has
anyone
here had to adjust processes due to lead-free component terminations?
Thanks,
Blair
**********************************************************************
This email and any files transmitted with it are confidential and
intended solely for the use of the individual or entity to whom they
are addressed. If you have received this email in error please notify
the system manager.
This footnote also confirms that this email message has been swept
for the presence of computer viruses.
www.hubbell.com - Hubbell Incorporated
**********************************************************************
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
