Carl,

David Geiger, and others from Flextronics presented a paper at APEX that
looked at, among other things, the ability of lead-free alloys to
self-center PBGA and CCGA devices.  The results were that PBGA's
self-centered as usual at up to 75% misplacement and CCGA's could
self-center but only up to 25% misplacement.

Paper was titled "Development of Assembly and Rework Precesses for Large and
Complex PCBs Using Lead-Free Solder."  It was presented at Session 29,
Lead-Free Assembly II.

Best regards,

Kevin Gaugler
R&D Manager
Solder Paste Operations
EFD, Inc.

www.efdsolder.com
<mailto:[log in to unmask]>
phone:  (401) 333-3800 x2221
fax:       (401) 333-4954



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Carlr Ray
Sent: Thursday, March 04, 2004 9:19 AM
To: [log in to unmask]
Subject: [TN] Self centering of lead free


Hi All,
 We are preparing to perform some experiments with lead free processing
in my facility. One of the areas we are considering looking into is the
reduce surface tension of lead free paste and the effect on devices
which have self centering characteristics such as BGAs.
 Has anyone "out there" performed these types of experiments and if so
can they provide the data and methods used?



===============================
Carl Ray
Sr. Manufacturing Engineer
13000 S. Memorial Parkway
Huntsville, AL 35807
Desk: 256-882-4800 ext. 8845
Fax: 256-882-4082
Cell: 256-990-1990
[log in to unmask]
===============================

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