Hi All,
 We are preparing to perform some experiments with lead free processing
in my facility. One of the areas we are considering looking into is the
reduce surface tension of lead free paste and the effect on devices
which have self centering characteristics such as BGAs.
 Has anyone "out there" performed these types of experiments and if so
can they provide the data and methods used?



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Carl Ray
Sr. Manufacturing Engineer
13000 S. Memorial Parkway
Huntsville, AL 35807
Desk: 256-882-4800 ext. 8845
Fax: 256-882-4082
Cell: 256-990-1990
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