Our organization has attended several seminars and gathered information.  We feel that we can comply but the main issues causing us to slow down are component availability and solder paste formulations.  We want to stay in an aqueous paste not a no-clean and most of the Lead frees right now that we have looked at are mainly no-clean.  This should change towards the end of the year but until washable pastes are available we are slowing down.  The component manufacturers are missing the boat, again.  Sort of reminds me of surface mount when it was new.  Most designs had to suffer through the conversion to surface mount due to component package availability.  Why is this part of our industry allowed to drag their feet to the bitter end?

Kat

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------