Hi Blair! One issue to consider with the industry move toward Pbfree
soldering processing is that a number of component fabricators are moving
to matte tin as a component lead finish. Matte tin is not as robust in
terms of solder process and shelf life solderability in comparison to a
tin/lead component lead finish (matte tin oxidizes must faster). The use of
a nitrogen reflow environment and possible changes in your flux formulation
are two possible avenues of investigation to increase your reflow process
window . Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




                      "Blair K. Hogg"
                      <blair.k.hogg@GAI-T        To:       [log in to unmask]
                      RONICS.COM>                cc:
                      Sent by: TechNet           Subject:  [TN] Lead-free components in SnPb processes
                      <[log in to unmask]>


                      03/03/2004 09:28 AM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to "Blair
                      K. Hogg"







Hi Technetters,

We've been seeing increasing problems in our SMT processes with wetting of
component leads and I am wondering if our processes which were designed
around all SnPb materials now need to be updated as I have a strong
suspicion that we are seeing components with lead-free terminations.

Are lead-free components drop-in replacements in SnPb processes? Has anyone
here had to adjust processes due to lead-free component terminations?

Thanks,

Blair


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