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March 2004

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Subject:
From:
Charles Caswell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Mar 2004 16:22:02 -0600
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Thanks. We are thinking about printing paste on the pads. We may have already
ordered the stencil. I don't think we will be using the hot bar because of
the uneven thermal loading on the pads but it is still possible. We are
somewhat limited in options by the configuration of the assy. 
-----Original Message-----
From: Mike Szuch [mailto:[log in to unmask]]
Sent: Wednesday, March 03, 2004 3:05 PM
To: [log in to unmask]
Subject: Re: [TN] hot bar soldering


Advantages of hot bar are localized heating, leads held in place and low
cost. Ground planes can be an issue since they suck a lot of heat. Look for
good ramp control of heat profile. Hot bar works best with solder pre-forms
or pre-reflowed solder on pads. Raw paste is difficult to relow
consistantly. Hope this helps. I spent 13 years with Hughes/Palomar,
contact me if you need more detail. Mike.

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