Several liquid dielectrics are available for laser via formation.
MacDerid makes a Macuvia dielectric that can be used to fill higher
copper topographies and could be then bonded further to complete the ML
package. I do not know the modulus constraints of the material - a link
to the site is:
http://www.macprintedcircuits.com/advanced/
I know that Ciba makes one or more also -
Jeffrey Bush
Director, Quality Assurance and Technical Support
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302-1890
Tel. 802.257.4571.21 Fax. 802.257.0011
[log in to unmask]http://www.vtcircuits.com
-----Original Message-----
From: Jim Henderson [mailto:[log in to unmask]]
Sent: Wednesday, March 31, 2004 11:48 AM
To: [log in to unmask]
Subject: [TN] flex coversheet alternatives
Has anyone heard of an industry accepted LPI flex mask or photoimageable
coversheet. Squeeze out is becoming a huge problem on 3 oz. cu @ 8 mil
spacing.
Thanks
Jim H.
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