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March 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 31 Mar 2004 16:01:16 -0500
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Several liquid dielectrics are available for laser via formation.
MacDerid makes a Macuvia dielectric that can be used to fill higher
copper topographies and could be then bonded further to complete the ML
package.  I do not know the modulus constraints of the material - a link
to the site is:

http://www.macprintedcircuits.com/advanced/

I know that Ciba makes one or more also -


Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Jim Henderson [mailto:[log in to unmask]] 
Sent: Wednesday, March 31, 2004 11:48 AM
To: [log in to unmask]
Subject: [TN] flex coversheet alternatives


Has anyone heard of an industry accepted LPI flex mask or photoimageable
coversheet.  Squeeze out is becoming a huge problem on 3 oz. cu @ 8 mil
spacing.

Thanks
Jim H.

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