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March 2004

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Subject:
From:
"Reeves, Tim R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 31 Mar 2004 14:03:41 -0500
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Everyone is saying inadequate glass etch but few fabricators these days are
really using a glass etch. Drilling doesn't look good, but I'd say it's
over-aggressive desmear. That's why so much glass fiber protrusion.
Franklin, what was desmear condition? Alkaline permanganate? How long, what
temp.? One-pass or two? Is it ordinary FR-4, high Tg, or more high
performance material?
 The plating definitely looks thin, based on comparison with inner foil,
whether it's 1 oz. or 1/2 oz.

Tim Reeves
Tyco Printed Circuit Group - Dallas Division


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Tuesday, March 30, 2004 9:08 AM
Subject: Re: Hole wall quality


Hi Franklin,
Whether or not these PWBs will give trouble in service depends on the
product
appllication--o.k. for benign environments, likely to fail in servere
environments. The certainly are not the prettiest x-sections I have
seen--inadequate
glass etch, some glass-fiber rip-out, l plating rather thin---all resulting
in
stress risers in thin plating that is thinner still localized.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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