Hi Angela!

I put your Word Doc with the pictures up on the page. Go to:

http://www.stevezeva.homestead.com and look for AngelasPaper.doc

In looking at the pictures, and talking this over with our Quality manager
here if we saw something like that on x-ray, we wouldn't ship them until they
were reworked.

Using IPC 610C section 6.5.3.1, and/or 12.4.11 to define your situation as a
"Process Indicator" is stretching things a bit in my opinion...this is much
more than a process indicator.

From my understanding, putting an assembly on a vibration table is to screen
out solder joint defects, not to shake solder splashes beneath parts
loose...also time on a vibration table is not the same as the environment that the
assembly is going to really see on a aircraft. I'd be afraid of these splashes
coming loose eventually.

One thing that I think you would reject these on, based on the wording in the
two -610 sections above, is splashes DO violate minimum electrical clearance.

As I said before I'd be afraid, very afraid to let this assembly ship...but
that's just ol' paranoid me.

-Steve Gregory-

Hi Steve.

I am in desperate need of help from the forum. I wanted you to post the
before and after pictures.

What you are viewing in the attachment is x-ray of solder splashes under a
leadless chip carrier, as well as resistors, before and after vibration.

The pictures were to prove the splashes  would not move and pose a hazard in
end environment. To answer the question before you ask, yes we are Military.

We are aware of what we did wrong, but my boss (Quality Manager) has given me
the task to be his enemy and find a reason to reject this and not treat it as
a process indicator (IPC 610C section 6.5.3.1). I could give you lots of more
detail,
but I don't want to take any more of your time. This is very time sensitive
and thousands are riding on the response.

Thank you very much.

Angela Gregor, Sr. Training Admin.



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