I would think that you would have to address the base process with "standard" rework/repair/touch-up to make sure there is no adverse interaction with any of the SMT paste residues or wave flux residues (either activated or un-activated (exposed to flux activation temperatures)).
That way at least you addressed the materials that are used rather than giving carte blanche to whatever they want to use. The downside is that it makes future changes more difficult.
>>> [log in to unmask] 03/29/04 10:44AM >>>
OK class, time for your next assignment. Once again, assume you are in the
process of evaluating the assembly process, either your own or a
subcontractors.
Question: Do you qualify just the base assembly process with no
rework/repair/touch-up operations OR do you include such post-assembly
processes as part of the accept/reject evaluation?
Doug Pauls
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