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March 2004

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Subject:
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 29 Mar 2004 09:43:31 -0500
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Thanks Steve,

I assume this applies to the collapsed height, like spheres with a diameter
of 0.050" will be 0.0375" high after soldering. But is it possible to put
some tolerances on this, let's say <the height after soldering will be
0.037" +/- 0.004"> ? Of course, it is assumed that the process is stable,
consistent volume of printed paste, and consistent reflow recipe.

Best regards,
Ioan

> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: Monday, March 29, 2004 9:09 AM
> To:   [log in to unmask]; [log in to unmask]
> Subject:      Re: [TN] BGA height after soldering
>
> Hi Ioan!
>
> A good figure to use is 25%...of course this goes without saying the
> figure only applies to eutectic balls.
>
> -Steve Gregory-
>
>
>
>
>       Hi Techos,
>
>       a question about BGA collapsing. I have an application where we have
> to fit
>       an assembled PCB into a tight place. The highest part is a BGA and I
> wonder
>       if anybody has knowledge of the height tolerances after soldering.
>
>       Thenks,
>       Ioan
>
>
>
>

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