Who can support us to answer what the criteria is to perform thermal cycling to
ensure the BGA solder joint reliability ?
-----Original Message-----
From: TechNet 代理 Tempea, Ioan
Sent: 2004/3/29 [星期一] 下午 09:28
To: [log in to unmask]
Cc:
Subject: [TN] BGA height after soldering
Hi Techos,
a question about BGA collapsing. I have an application where we have to fit
an assembled PCB into a tight place. The highest part is a BGA and I wonder
if anybody has knowledge of the height tolerances after soldering.
Thenks,
Ioan
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