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March 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 29 Mar 2004 08:15:28 -0500
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ENIG processes are costly to maintain and this finish if not the
preferred solution for soldering planarity.  The Nickel deposition
process requires a good deal of attention and the main issue is the
process going south is the lack of work being processed through it.  The
cost of ownership of the ENIG outweighs the benefits sharply and both
tin and silver exist as economic alternatives to gold and do not have
the disadvantages which go beyond the black pad condition.  Silver
appears to be the most effective alternative as it is more forgiving for
time delays between thermal excursions, but many assemblers have adapted
their process to also run tin effectively, which has the lowest overall
cost impact per unit.

Stay away from ENIG and evaluate tin and/or silver.


Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Paul Truit [mailto:[log in to unmask]] 
Sent: Saturday, March 27, 2004 10:03 AM
To: [log in to unmask]
Subject: [TN] Black Pad Prevalence


I have searched the archives and have found lot's of good info but
nothing in regard to the prevalence or the statistical occurrences of
this event.

I have run tens of thousands of ENIG boards and I haven't observed this
defect but I am concerned enough to ask.  Is this a board fabricator
controllable issue that has been minimized?

Have you observed this phenomenon?  How often will this occur?  Is
immersion silver the better way to go to assure the reliability and
quality of the products?
--
Paul Truit, Mfg. Eng.
RBB Systems, Inc.
4265C E. Lincolnway
Wooster, OH  44691
Ph. (330) 567-2906 ext 514
Fax (330) 263-5324
Email: [log in to unmask]

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