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March 2004

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Subject:
From:
"Blair K. Hogg" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Mar 2004 10:28:19 -0500
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Hi Technetters,

We've been seeing increasing problems in our SMT processes with wetting of component leads and I am wondering if our processes which were designed around all SnPb materials now need to be updated as I have a strong suspicion that we are seeing components with lead-free terminations. 

Are lead-free components drop-in replacements in SnPb processes? Has anyone here had to adjust processes due to lead-free component terminations?

Thanks,

Blair


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