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March 2004

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Mar 2004 16:08:20 EST
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Hi All,

Wee Mei's Engineer decided not to share the pictures to post on my
page...sorry.

Hey you guys are being way too quiet today!

Just as a note, got my 30-day trial Zephrytronics ZT-6, got some nozzles
made, and pulling a connector out of a big-thick backplane has never been so easy!

The whole cycle from placing the board over the nozzle to removing a
connector takes me about 5.5 to 8 minutes...I know I can shorten that time by placing
the board I want to rework in a oven to get it pre-heated first, then placing
it over the ZT-6. Todays cycle time was taking the board from ambient
temperature to reflow temperature only with the ZT-6.

What was really great that the connector came out so easily with no damage at
all to the board. When looking at the connector location, you couldn't even
tell that there had been heat applied there. The backplane is .135" thick FR-4
laminate, and there was no discoloration whatsoever to the soldermask or
laminate.

So I give this a resounding "Thumbs-up"!!!

Might take some pictures and post on my page of me pulling a connector...

-Steve Gregory-



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