Leland, If so you will already be seeing that since many components are
already switched over to lead free or have planned release dates for 2004
both SMT and thru hole. Some of our inventory including IC's and chips are
lead free. One of the issues is that many of the component manufacturers are
not changing part numbers to differentiate although some are. Bulletins from
the manufacturer go out and you should be able to contact suppliers for
specific company plans to switch to lead free in anticipation of 2006.

Dave Chapman
CSI

-----Original Message-----
From: Leland Woodall [mailto:[log in to unmask]]
Sent: Wednesday, March 24, 2004 11:12 PM
To: [log in to unmask]
Subject: [TN] Mixed Technology Processing Concerns


Hello All,

I just read an article posted on AIM's website (www.aimsolder.com) that
raised some concern about using lead-free paste in conjunction with Sn/Pb
coated component leads.

Does anyone know of a possible reliability issue if the tables are switched
(a mixing of Sn/Pb paste with lead-free coated component leads)?

Thanks in advance,

Leland Woodall
Quality Coordinator
Keihin Carolina System Technology, Inc.

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