Design and Process Implementation for Embedded Passives Technology
April 14-15, 2004 at IPC's Headquarters in Northbrook, IL

Open panel discussion April 16, 2004 at Motorola, Inc.

Instructors: Dennis Fritz, MacDermid, Inc.; John (Jack) Fisher, Interconnect Technology Analysis, Inc.; Richard Snogren, Coretec Denver, Inc; .Dieter Bergman IPC; and John Andresakis, Oak-Mitsui, Inc.

With the explosive growth of wireless technology and high speed/frequency circuits, implementing embedded passives component technology has become vital to electronics manufacturing. 

Saving assembly real estate is no longer just an important benefit since performance often requires that resistor and capacitor devices be close to the power I/Os of the semiconductor.  Embedded passive technology fulfills this requirement.

This two day workshop will cover the how and why of conditions in the materials and assembly processes that impact product performance. The difference between integrated and embedded passive components will be explained. 

This course will provide understanding and know-how for those involved in design and manufacturing process implementation. Risk assessment and trade-offs of embedded passive technology and its integral involvement in the interconnect substrate will be also covered.

IPC thanks Motorola, Inc. for opening up their facility for an open panel discussion with engineers from Motorola and other industry representatives who are using embedded passive component technology. Get a first-hand insight into how the implementation of embedded passives technology has improved performance and reduced the costs of their electronic products.

Price: $595 IPC Members                 $895 Non-members

Download the registration form and more information here go to http://www.ipc.org/calendar/DesignforEP_41404/DesignforEP_041404.htm, or contact Christi Poulsen at [log in to unmask] or via phone at 847-790-5327.

If you are interested in participating in the open panel discussion at Motorola, please contact Alexandra Curtis at 847-790-5377 or by e-mail at [log in to unmask] 

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