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March 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Mar 2004 10:24:09 -0500
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text/plain (55 lines)
I would say no - CAF is seen on packages that have good drilling,
lamination and glass wet-out.  Tight designs with pin placed close to
utilities should be reviewed closely for minimum spacings and the use of
CAF resistent materials (some other than FR4 also) may also be needed to
be evaluated.



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Kane, Joseph E [mailto:[log in to unmask]] 
Sent: Wednesday, March 24, 2004 10:09 AM
To: [log in to unmask]
Subject: [TN] CAF And PWB Subsurface Imperfections


Does anything we know now about conductive anodic filaments indicate
that we should rethink acceptance of measles, or reconsider criteria for
delamination?

-Joe

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