Hi Gang! I'll take a swipe at finding the middle ground on this one! Both
Graham and Dave are correct from each of their perspectives - Graham has a
multitude of real life use data of AR type conformal coating being used in
a number of severe use environments successfully and Dave has been involved
in some of the "uglier" aspects of when AR type conformal coating is an
incorrect application for a given use environment. Collins published a
paper on an investigation comparing AR and Paralyene conformal coating
types with BGA style components. The investigation shows both coating types
work well and the application method (as other TechNetees have mentioned)
can be critical in impacting solder joint reliability. Steve - if I send a
copy of the paper can you put it out on your website?

Dave Hillman
Rockwell Collins
[log in to unmask]




                      Steve Gregory
                      <[log in to unmask]        To:       [log in to unmask]
                      M>                       cc:
                      Sent by: TechNet         Subject:  Re: [TN] acyrlic coating deformed BGA balls
                      <[log in to unmask]>


                      03/23/2004 10:01
                      PM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to
                      SteveZeva







Hi Graham,

I must say, I find your comments pretty harsh. David Douthit has many
publications that are accepted as factual, and he always back-ups
everything that he
says with documentation that proves what he says is fact.

If you can show, or lead us to anything that he says is false, please
provide
us links, or anything else that would substantiate what you are saying...

Best regards,

-Steve Gregory-
David

Your comment is grossly misleading.

You cast aspersions on the intelligence of the users

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------