Frank,
After reviewing my data sheets for the CB100 theTg
of the cured silver epoxy is only 115C with a 35ppm TCE, I imagine that
would explain what you experienced on your boards. The key word is
"Conductive ViaPlug" not "Conductive ThruHole Plug"

Tony Steinke
AIT-Atlanta Inc.

Tony Steinke
----- Original Message -----
From: "Franklin Asbell" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, March 23, 2004 1:08 PM
Subject: Re: [TN] PWB delamination and silver epoxy fill


> The reason I say they are probably large vias is we had seen that once in
> the past. Customer spec'd a 28 mil via with silver epoxy fill. They placed
a
> heavy BGA component right over those filled 28 mil pads/vias...the larged,
> silver-filled vias acted as a heat-sink drawing too much heat into them
> causing delamination only around those vias. We reduced the hole size, the
> problem went away. We also did another job for them where we could not
> reduce the hole size, we used ceramic fill instead of epoxy, no problems
at
> all... Just one persons experience, hope this helps...
>
> Franklin
>
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