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March 2004

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Subject:
From:
Franklin Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 Mar 2004 11:39:03 -0600
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I'll bet a dollar the vias are close to 30 mils in diameter????


----- Original Message -----
From: "Rick Thompson" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, March 23, 2004 11:36 AM
Subject: [TN] PWB delamination and silver epoxy fill


We have some boards we're building for a customer that they have spec'd in a
conductive silver epoxy fill for the through-vias. During reflow, these
boards are delaminating in some areas, always radiating out from a via. The
PWB vendor is saying that they believe this is related to using the silver
epoxy with FR4 and are recommending a change to Gtek or something similar in
Tg.

My question is, is this a common occurrence with FR4 and this type of silver
epoxy fill?

Thanks in advance,


Rick Thompson
Sr. SMT Process Engineer

SMTEK International, Inc.
+1 (805) 532-2800
[log in to unmask]




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