Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 23 Mar 2004 09:53:10 EST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Au contraire, Monsieur!!
I've seen round pads used numerous times! Mostly on 0402 footprints
though...I suppose it wouldn't hurt on 0603 pads.
The benefits are a reduction in tombstones, and increased space for routing
traces.
I'll send you a picture of a board that I have here now that has round pads
(there's part of a dime in the picture for scale), but I've got more than just
a few boards that I build here that uses round pads, and from my experience,
it does help prevent tombstoning. I have less problems with tombstones on
Hope this helps!
-Steve Gregory-
> I'll take the total lack of response to mean nobody has seen this.
>
> Thanks anyway.
> Jason
>
> -----Original Message-----
> From: Jason Lineback
> Sent: Monday, March 22, 2004 10:37 AM
> To: TechNet+AEA-IPC.ORG
> Subject: +AFs-TN+AF0- Round SMT pads
>
>
> Hello
>
> Is there a trend coming to use round pads for SMT components?
>
> I work for a contract manufacturer and within the last month we have quoted
> 2 assemblies from 2 different customers, both had round pads for 0603
> components. Both customers outsourced their board design. We do not know if both
> customers used the same designer.
>
> We have not seen this before and have not found any information supporting
> this type of design. Anyone have any information on processing these?
>
> Thanks
> Jason Lineback
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|