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March 2004

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Subject:
From:
Tony Steinke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 Mar 2004 08:52:34 -0500
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Russ,
I would lean towards moisture/poor rinsing of innerlayers. What is your
trace edge to drilled hole spacing-sounds like it must be pretty tight?.
----- Original Message -----
From: "Russell Burdick" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, March 22, 2004 4:38 PM
Subject: [TN] high resistance shorts


> Here's a question for all you electrical fans...( ha, ha, ha, not those
type
> of shorts)
>
> We are getting high resistance shorting on multilayer polyimide only
boards.
> Inner layers test out with no problem. Immediately after outer layer etch
> there are the shorts. Omega meter testing shows no ionic contamination at
> this stage. Baking prior to ET reduces the number of shorts, although
after
> a few days the shorts are back. Construction of board is foil copper at
> lamination, not cap-core.
>
> As usual, any and all help is greatly appreciated.
>
> Russ
>
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