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March 2004

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Subject:
From:
Doug Corbett <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 22 Mar 2004 17:14:08 -0700
Content-Type:
text/plain
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text/plain (52 lines)
Solder mask thickness is +AH4-1-2 mils over bare laminate. 0.4 mils over copper
is the usual minimum specification, but may go up to as high as +AH4-1 mil (for
wide traces). The actual thickness will depend on the process your supplier
is using.
They should be able to give that number to you as part of an SPC chart
mean/range.

Doug

-----Original Message-----
From: DUTTON Phil +AFs-mailto:phil.dutton+AEA-TENIX.COM+AF0-
Sent: Monday, March 22, 2004 5:10 PM
To: TechNet+AEA-IPC.ORG
Subject: +AFs-TN+AF0- Solder Mask properties
Importance: Low


Hello,

Would someone be able to give me some information on LPI soldermask
properties please?
In particular, average thickness of application and dielectric constant
around 1GHz.

thanks,

Phil.

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