CALL FOR PARTICIPATION

IPC and Soldertec Global bring you the 2nd International Conference on Lead-Free Electronics "Towards implementation of the RoHS Directive"

June 21, 2004 - Educational Courses
June 22-23, 2004 - Technical Conference 
RAI International Congress and Exhibition Centre, Amsterdam, Netherlands

IPC - Association Connecting Electronics Industries and Soldertec Global - a division of Tin Technology, are sponsoring this 2nd International Conference on Lead-Free Electronics from June 22-23, 2004 in Amsterdam. 

This conference follows the highly successful event in Brussels last year and will bring together top class experts for a truly international and informative conference on this subject.

The EU RoHS Directive (Restriction of Hazardous Substances in Electrical and Electronic Equipment) requires all affected electrical equipment put on sale in Europe from 1 July 2006 to be lead-free, with similar legislation now being considered in other parts of the world such as China. 

The change to Pb-free is affecting the global marketplace, motivating all suppliers and manufacturers to eliminate lead according to agreed transition plans. Producers of equipment not directly affected by the legislation e.g. aerospace, are also assessing the effects of changes in the supply chain and customer demand.  

Papers from environmental managers and technical experts are sought on any relevant subjects, including:
* European/Chinese/other legislation on hazardous materials and recycling
* Legislative compliance, policy enforcement and product marking 
* Summary of voluntary implementation in other regions (America, Japan, Australia, Taiwan etc) 
* Company and research consortia projects and results 
* Design issues (for ease of production and disassembly)
* PCB issues (effects of lead-free process temperatures, board finishes etc)
* Component issues (effects of lead-free process temperatures, BGA's, obsolescence etc)
* New finishes (plating technology, solderability and tin whiskering)
* Comparisons of solder alloys (mainstream (e.g. SnAgCu, SnCu) and specialist (e.g. SnZnAl) compositions)
* Alternative means of substitution (conductive adhesives etc)
* Lead-free manufacturing (examples of implementation, process considerations, inspection etc)
* Repair and rework (process control, mixed alloy systems etc)
* Reliability evaluations (research, product test and in-service, including new test methods)
* Lead-free and other product sectors (automotive, aerospace etc)
* Environmental considerations and studies (material availability, toxicity issues etc)
* Recycling (examples, plans and concerns)
* Business issues (supply chains, cost - benefit analysis etc)

The Conference offers 30-45 minute time slots to allow time for the presentation and discussion. Some papers may be grouped together in a forum or panel discussion.

Please submit 200-300 word abstracts along with the attached form and a brief biography. The deadline for abstract submission is 26 March 2004. Please e-mail your abstract submission to Kay Nimmo at [log in to unmask]

EDUCATIONAL COURSES 
Proposals are also solicited from individuals interested in teaching full-day tutorials (six hours) or half-day workshops (three hours) to a class of up to 30 persons on topics in the field. Examples include; reliability, process issues, rework, plating and surface finishes, design for lead-free, design for recycling etc. Additional suggestions are also welcome.

An honorarium is offered to tutorial and workshop instructors. A brief description and additional information on any such proposals should be submitted according to the guidelines for abstract submission i.e. by completion of the attached form.


SPONSORSHIPS AND EXHIBITS
Companies interested in event sponsorship opportunities or exhibiting in our tabletop exhibition, please email Alexandra Curtis at [log in to unmask]

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