There is an IPC committee D-33d Via Protection that has some
information/guidelines ina type of user's guide for via fill along with via protection. You
can pick up the latest strawman we are working on at their committee page on
the IPC website.
Later this week there is a teconf to establish what attributes should be
included in
industry user’s guide as well as to initiate a round robin testing plan for
developing acceptance criteria. Currently there is a listing of various
different acceptance criteria different companies use.
Last week when we were talking about solder voids in vias, Werner cautioned
that these could present a real realiability issue, but voids in fill materials
and conductive fill materials did not pose the same reliability problems.
Please let John Perry know if you would like to join D-33d in its' efforts
and stay tuned to learn how you can help and benefit from the effort.
Susan Mansilla
Robisan Lab
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