Dear Technetters,

Sub: PCBs with Exposed Pad Thin Quad Flat Pack ( ETQFP)

One of our customers want a PCB with ETQFP package which has a better thermal efficiency. First time we are going to fabricate this type of PCBs. I am having some queries  regarding design and fabrication aspects. Pl clarify.


1 What are the precautions to be taken for design of PCBs with this package.

2.Die pads and Thermal pad of the package are not in the same plane (not coplanar). Tolerance given by the manufacturer is 50microns to 150 microns. Does this mean while fabricating PCBs this level difference is to be maintained. If so, How to achieve this?

Thanks in advance

Regards,
Mr.Murulidhara S.
Deputy Chief Engineer ,
PCB and Chemical Lab - R&D,
ITI Ltd. ,
Dooravani Nagar , 
Bangalore
INDIA
PIN-560 016

Ph : 91-080-8503959
Fax : 91-080-5650971





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