Am I old if I comment....man, I remember those...the peel out liners from inside the metal cap..., jeeesh, where is my geritol
Franklin
----- Original Message -----
From: James TerVeen
To: [log in to unmask]
Sent: Friday, March 19, 2004 10:50 AM
Subject: Re: [TN] ntc [TN] Process Qual Question Round 2
Not just the coke in a bottle for a quarter but the special bottle tops you
saved on the special sheet you got at the store for football players and
all the stuff you worried about back in the early sixties.
Kathy Kuhlow
<[log in to unmask] To: [log in to unmask]
M> cc:
Sent by: TechNet Subject: Re: [TN] Process Qual Question Round 2
<[log in to unmask]>
03/19/04 11:31 AM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to Kathy
Kuhlow
1. I think mixing the technology on one coupon is a mistake because of the
ramifications that could be caused by auto insert versus machine insert,
wave or hand solder, etc. I would rather see different coupons for
different families or technologies. You could have one that is just
through hole, one that is typical mainstream sm production *have fun
defining mainstream*, and a more advanced coupon for more cutting edge
parts.
2. I would add more ranges in discretes. Like bottom only parts, bga
diodes, ranges of 0201, 0402, 0603's etc. I would also like to see tsops
and that type.
3. Cold coke in a bottle for a quarter.
Kat
>>> [log in to unmask] 03/19/04 10:17AM >>>
OK class, time for your next assignment.
Again, the topic is "qualifying" a manufacturing process, either in house
or from a supplier. Steve Gregory has been kind enough to post a picture
for me
http://www.stevezeva.homestead.com and look for "IEC Coupon".
This is a coupon that has been proposed in the IEC specification that
Graham Naisbitt is working on. There is some re-design efforts going on
currently. One such effort is to add through holes for a connector or pin
field. As you can see from the picture, the current board is purely
surface mount.
So, your assigment, in essay form, is to answer the following three
questions:
1. As a process qualification vehicle, should the vehicle be pure
surface mount, or mixed technology (both SMT and PTH), and why?
2. What would you add or subtract from the test board to make it more
useful to you?
3. Should there be two offerings of qualification vehicles, "cutting
edge" vs. "mainstream"? Cutting edge would incorporate fine pitch, flip
chips, CSPs, etc., where the mainstream board would not.
4. Extra Credit question: What was the greatest thing "before" sliced
bread?
Doug Pauls
Rockwell Collins
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
