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March 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 18 Mar 2004 13:27:41 -0600
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HASL finishes should only be applied using horizontal processing
equipment.  This will ensure that the thickness control is managed to the
extent needed for SMT assembly.

The basic rule is to measure land areas near the center and avergage in
solder thickness from 0.2 to 0.9 mils.  Maintaining thickness in this
fashion should protect both from thin and thick issues.  No real
specification exists, but some good engineering information is available at
http://www.smtinfo.net/Db/_HASL.html.

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