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March 2004

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 18 Mar 2004 10:40:40 -0500
Content-Type:
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text/plain (181 lines)
Thanks a lot. It sounds like and "unexpected" result.  I'll take a look because I'd also like to know what they are saying about "Black Pad".

Regards,

Vladimir
Sent from my Blackberry Wireless 
Vladimir Igoshev, 519-888-7465 ext.5283


-----Original Message-----
From: [log in to unmask] <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>; Vladimir Igoshev <[log in to unmask]>
Sent: Thu Mar 18 10:29:34 2004
Subject: RE: [TN]

Atotech presented a paper at IPC that showed P levels above 10 (up to 14%)
actually resulted in better solderability and less brittle fracture of
solder joints.

Not sure what is gospel truth here, but I thought I would throw that out for
you all to opine. 

Doug Corbett
L-3 Communications-Systems West

-----Original Message-----
From: Vladimir Igoshev [mailto:[log in to unmask]]
Sent: Thursday, March 18, 2004 8:12 AM
To: [log in to unmask]
Subject: Re: [TN]
Importance: Low


I forgot to answer your "phosphorous" question. "Normal" concentration is
around 7-10% (that is what people say). A higher level will result in "Black
Pad", but solderability should be fine. I'd quests that even higher content
of P could result in a solderability issue. Yes, you can check (rather
estimate) the content with EDS, but I wouldn't do it right from the surface,
but rather use a cross-sectioned component.

Regards,

Vladimir

Vladimir Igoshev, 
Research in Motion



-----Original Message-----
From: Somtawin Pornpottanamas [mailto:[log in to unmask]]
Sent: Wednesday, March 17, 2004 8:21 PM
To: TechNet E-Mail Forum.; Vladimir Igoshev
Subject: RE: [TN]


Hi Vladimir,
By visual and SEM, we couldn't see anything on surface, all good and bad
part show nothing different. Just EDX analysis that show Fe contain in
bad part. So we though may be the Nickel bath had Fe contaminated. 
For %P , Can we check by EDX? And how high to cause the problem?

Thanks & Regards,  

Somtawin Pornpottanamas
Material Engineer


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Thursday, March 18, 2004 3:57 AM
To: [log in to unmask]
Subject: Re: [TN]

Hi Somtawin,

First thing I'd suspect is oxidation/contamination of the solderable
surface. EDS may not catch it if it's just oxidation (the layer would be
too thin for the method). lathe fact that you see Fe does not make me
very optimistic. How does it show up, as inclusions (embedded into the
surface) or "dissolved" in the plating? Second thing would be the
content of P. If it's too high, then it might be a problem as well.

Regards,

Vladimir

Vladimir Igoshev, 
Research in Motion



-----Original Message-----
From: Somtawin Pornpottanamas [mailto:[log in to unmask]]
Sent: Tuesday, March 16, 2004 11:44 PM
To: [log in to unmask]
Subject: [TN]


Now we have some problem in one component. The component was plated
Nickel (electroplated) , and  base material is phosphor bronze. The
problem we found was solderability failed. We try to find out what's the
cause. We have to inspect the solderability   by dipping test before
passed to the line. Some failed some passed. we had done the analysis to
compare the good one and bad one. We had check Nickel thickness (XRF,
cross section), phosphorus content and grain structure (by SEM & EDX).
From  the data , it show the different. But we don't know how does it
effect to the solderability. Does anyone know what 's the parameter that
affect to solderability, how? And what 's about the contaminate in
Nickel bath ? 

From EDX we found Fe element in bad part, does Fe effect to
solderability? 

 

Thanks & Regards,

Somtawin Pornpottanamas

 


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