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March 2004

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From:
"Taylor, Royce" <[log in to unmask]>
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Date:
Thu, 18 Mar 2004 07:55:03 -0600
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We have one customer that has more than one assembly with TSOPS utilizing alloy 42 (TI parts I believe). For these assemblies I run my Peak relow temps higher than I normally do (220-230 C.) with good results.



Royce

*************************************************************************

Royce Taylor

Process Engineering/Production

Suntron Corporation NEO

104 Glenn Street

Lawrence, MA 01843

(978)747-2061 voice

(978)747-2010 fax

[log in to unmask]







-----Original Message-----

From: Bev Christian [mailto:[log in to unmask]]

Sent: Thursday, March 18, 2004 8:25 AM

To: [log in to unmask]

Subject: Re: [TN] TSOPs





Edwin,

Good for you for using the archives!  Short answer: yes, rejected!

Bev Christian

Research in Motion



-----Original Message-----

From: Edwin Louis [mailto:[log in to unmask]]

Sent: March 18, 2004 8:21 AM

To: [log in to unmask]

Subject: Re: [TN] TSOPs





I notice in the IPC Archives that all of the questions and comments about

alloy 42 were in the

~1994-1995 time period. Has the general population out there totally

rejected TSOPS

with alloy 42 leads? No comments or questions appear from 2001 to present.



-----Original Message-----

From: Werner Engelmaier [mailto:[log in to unmask]]

Sent: Tuesday, March 16, 2004 6:43 AM

To: [log in to unmask]

Subject: Re: [TN] TSOPs





Hi Edwin,

>Are there any specifications ,standards or articles on soldering TSOPs

>especially ones with Alloy42 leads?

There are some papers:

Engelmaier, W., "Alloy 42--Not a Choice Material for Surface Mount Leads," 

35th Annual IPC Meeting, Bal Harbour, FL, April 1992.  

Engelmaier, W., and B. Fuentes, "Alloy 42: A Material to be Avoided for 

Surface Mount Solder Component Leads and Lead Frames," Proc. Surface Mount 

International Conf., San Jose, CA, August-September 1994, pp. 644-655; also

in Proc. 

Int. Electronics Packaging Conf. (IEPS), Atlanta, September 1994, pp.

503-516; 

also in Proc. 19th Ann. Electronics Manufacturing Sem., Naval Air Warfare 

Center, China Lake, CA, February 1995, pp. 5-20; also in Proc. NEPCON West

‘95, 

Anaheim, CA, February-March 1995, pp. 385-395; also in Soldering & Surface

Mount 

Technology, No. 21, October 1995, pp. 20-25.  



Regards,

Werner Engelmaier

Engelmaier Associates, L.C.

Electronic Packaging, Interconnection and Reliability Consulting

7 Jasmine Run

Ormond Beach, FL  32174  USA

Phone: 386-437-8747, Fax: 386-437-8737

E-mail: [log in to unmask], Website: www.engelmaier.com 



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